封装:
Through Hole(206)
-(20)
Surface Mount(5)
(1)
PC Board(1)
多选
包装:
Tube(233)
型号/品牌/封装
品类/描述
库存
价格(含税)
资料
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距C- Grid®分离式接头,有很高的知名度,双排,直角, 16电路, 6.10毫米( .240 ” )配合针脚长度,锡(Sn )镀层 2.54mm (.100") Pitch C-Grid® Breakaway Header, High Profile, Dual Row, Right Angle, 16 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
    8334
    10-99
    9.1080
    100-499
    8.6526
    500-999
    8.3490
    1000-1999
    8.3338
    2000-4999
    8.2731
    5000-7499
    8.1972
    7500-9999
    8.1365
    ≥10000
    8.1061
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距C- Grid®分离式接头,有很高的知名度,双排,直角, 4回路, 6.10毫米( .240 ” )配合针脚长度,锡(Sn )镀层 2.54mm (.100") Pitch C-Grid® Breakaway Header, High Profile, Dual Row, Right Angle, 4 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
    6321
    5-24
    2.8485
    25-49
    2.6375
    50-99
    2.4898
    100-499
    2.4265
    500-2499
    2.3843
    2500-4999
    2.3316
    5000-9999
    2.3105
    ≥10000
    2.2788
  • 品牌: Molex (莫仕)
    封装:
    PC Board
    描述:
    集管和线壳 2x5 R/A HEADER Pb/Sn
    6589
    5-24
    2.5920
    25-49
    2.4000
    50-99
    2.2656
    100-499
    2.2080
    500-2499
    2.1696
    2500-4999
    2.1216
    5000-9999
    2.1024
    ≥10000
    2.0736
  • 描述:
    2.54毫米( .100 )间距C- Grid® PC板连接器,单列,直角, 1.0微米( 40μ ),锡(Sn ) , 4电路 2.54mm (.100) Pitch C-Grid® PC Board Connector, Single Row, Right Angle, 1.0μm (40μ) Tin (Sn), 4 Circuits
    1401
    10-99
    6.0600
    100-499
    5.7570
    500-999
    5.5550
    1000-1999
    5.5449
    2000-4999
    5.5045
    5000-7499
    5.4540
    7500-9999
    5.4136
    ≥10000
    5.3934
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    Conn Shrouded Header HDR 14POS 2mm Solder RA Thru-Hole Tube
    5805
    5-49
    12.2616
    50-199
    11.7376
    200-499
    11.4442
    500-999
    11.3708
    1000-2499
    11.2974
    2500-4999
    11.2136
    5000-7499
    11.1612
    ≥7500
    11.1088
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.00毫米( 0.079 )间距的Milli-电网™接头,直角,带罩,无铅, 12电路, 0.38μm ( 15μ ),金(Au ),电镀,无PCB定位器 2.00mm (.079) Pitch Milli-Grid™ Header, Right Angle, Shrouded, Lead-free, 12 Circuits, 0.38μm (15μ) Gold (Au) Plating, without PCB Locator
    3258
    10-99
    9.1320
    100-499
    8.6754
    500-999
    8.3710
    1000-1999
    8.3558
    2000-4999
    8.2949
    5000-7499
    8.2188
    7500-9999
    8.1579
    ≥10000
    8.1275
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.00毫米( 0.079 )间距的Milli-电网™接头,垂直,通孔,罩,无铅, 14电路, 0.38μm ( 15μ ),金(Au )电镀,中心极化槽, 2.00mm (.079) Pitch Milli-Grid™ Header, Vertical, Through Hole, Shrouded, Lead-free, 14 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot,
    9273
    10-99
    11.0760
    100-499
    10.5222
    500-999
    10.1530
    1000-1999
    10.1345
    2000-4999
    10.0607
    5000-7499
    9.9684
    7500-9999
    9.8946
    ≥10000
    9.8576
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    2.00毫米( 0.079 )间距的Milli-电网™接头,表面贴装,立式, 14电路, 0.38μm ( 15μ ),金(Au )选择性电镀,用压接塑料钉,无铅 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free
    5122
    10-99
    11.4720
    100-499
    10.8984
    500-999
    10.5160
    1000-1999
    10.4969
    2000-4999
    10.4204
    5000-7499
    10.3248
    7500-9999
    10.2483
    ≥10000
    10.2101
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    2.00毫米( .079 “ )间距的Milli-电网插座,表面贴装,顶面入口, 0.38um ( 15U ”),金(Au )镀层 2.00mm (.079") Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.38um (15u") Gold (Au) Plating
    2708
    5-49
    17.7255
    50-199
    16.9680
    200-499
    16.5438
    500-999
    16.4378
    1000-2499
    16.3317
    2500-4999
    16.2105
    5000-7499
    16.1348
    ≥7500
    16.0590
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    2.00毫米( 0.079 )间距的Milli-电网™插座,表面贴装(非常低调) ,顶面入口,带定位销, 0.38μm ( 15μ ),金(Au ),电镀,电路20 ,无铅 2.00mm (.079) Pitch Milli-Grid™ Receptacle, Surface Mount (Very Low Profile), Top Entry, with Locating Pegs, 0.38μm (15μ) Gold (Au) Plating, 20 Circuits, Lead-free
    9033
    5-49
    19.4337
    50-199
    18.6032
    200-499
    18.1381
    500-999
    18.0219
    1000-2499
    17.9056
    2500-4999
    17.7727
    5000-7499
    17.6897
    ≥7500
    17.6066
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    2.00毫米( .079 “ )间距的Milli-电网插座,表面贴装(非常低调) ,顶面入口 2.00mm (.079") Pitch Milli-Grid Receptacle, Surface Mount (Very Low Profile), Top Entry
    4654
    5-49
    13.3848
    50-199
    12.8128
    200-499
    12.4925
    500-999
    12.4124
    1000-2499
    12.3323
    2500-4999
    12.2408
    5000-7499
    12.1836
    ≥7500
    12.1264
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.00毫米( 0.079 )间距的Milli-电网™插座,侧面入口,通孔, 0.38μm ( 15μ ),金(Au )的选择性, 32电路,无铅 2.00mm (.079) Pitch Milli-Grid™ Receptacle, Side Entry, Through Hole, 0.38μm (15μ) Gold (Au) Selective, 32 Circuits, Leadfree
    2645
    5-49
    23.7627
    50-199
    22.7472
    200-499
    22.1785
    500-999
    22.0364
    1000-2499
    21.8942
    2500-4999
    21.7317
    5000-7499
    21.6302
    ≥7500
    21.5286
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.00毫米( .079 “ )间距的Milli-电网插座,垂直,通孔,双排, 3.00毫米( 0.118 ),尾长 2.00mm (.079") Pitch Milli-Grid Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length
    1792
    10-99
    8.7120
    100-499
    8.2764
    500-999
    7.9860
    1000-1999
    7.9715
    2000-4999
    7.9134
    5000-7499
    7.8408
    7500-9999
    7.7827
    ≥10000
    7.7537
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.00毫米( .079 “ )间距VHDM H板对板背板头,垂直, 8排,导针 2.00mm (.079") Pitch VHDM H Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin
    7353
    1-9
    278.9095
    10-49
    271.6336
    50-99
    266.0554
    100-199
    264.1152
    200-499
    262.6600
    500-999
    260.7198
    1000-1999
    259.5071
    ≥2000
    258.2945
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.00毫米( .079 “ )间距VHDM® H板对板背板头,垂直, 8排,导针,信号前端模块,打开高端版本, 80电路,引脚长度4.75毫米( .187 ” ) ,铅免费 2.00mm (.079") Pitch VHDM® H Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin, Signal End Module, Open End Version, 80 Circuits, Pin Length 4.75mm(.187"), Lead Free
    1122
    1-9
    126.7990
    10-49
    123.4912
    50-99
    120.9552
    100-199
    120.0731
    200-499
    119.4116
    500-999
    118.5295
    1000-1999
    117.9782
    ≥2000
    117.4269
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.00毫米( .079 “ )间距VHDM H板对板背板头,垂直, 8排,导针 2.00mm (.079") Pitch VHDM H Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin
    1962
    1-9
    112.3780
    10-99
    107.4920
    100-249
    106.6125
    250-499
    105.9285
    500-999
    104.8536
    1000-2499
    104.3650
    2500-4999
    103.6809
    ≥5000
    103.0946
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    1.85毫米由1.85毫米( 0.073由0.073 )节距2对GbX®背板L系列连接器系统,打开域名, 55电路,金(Au ) 0.76μm ( 30μ ) 1.85mm by 1.85mm (.073 by .073) Pitch 2-Pair GbX® Backplane L-Series Connector System, Open Header, 55 Circuits, Gold (Au) 0.76μm (30μ)
    5782
    1-9
    73.2550
    10-99
    70.0700
    100-249
    69.4967
    250-499
    69.0508
    500-999
    68.3501
    1000-2499
    68.0316
    2500-4999
    67.5857
    ≥5000
    67.2035
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    1.85毫米由1.85毫米( 0.073 “由0.073 ” )间距4对的GbX背板L系列连接器系统 1.85mm by 1.85mm (.073" by .073") Pitch 4-Pair GbX Backplane L-Series Connector System
    8516
    1-9
    68.7240
    10-99
    65.7360
    100-249
    65.1982
    250-499
    64.7798
    500-999
    64.1225
    1000-2499
    63.8237
    2500-4999
    63.4054
    ≥5000
    63.0468
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    1.85毫米由1.85毫米( 0.073由0.073 )间距4对GbX®背板连接器系统,打开域名,右键指南, 80电路,选择金(Au ) ,引脚长度5.55毫米( 0.218 ) 1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX® Backplane Connector System, Open Header, Right Guide, 80 Circuits, Selective Gold (Au), Pin Length 5.55mm (.218)
    7804
    1-9
    168.7280
    10-49
    164.3264
    50-99
    160.9518
    100-199
    159.7781
    200-499
    158.8978
    500-999
    157.7240
    1000-1999
    156.9904
    ≥2000
    156.2568
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    Conn Header 5pr 25col Open Ee Bp
    6184
    1-9
    522.8015
    10-49
    509.1632
    50-99
    498.7072
    100-199
    495.0703
    200-499
    492.3426
    500-999
    488.7058
    1000-1999
    486.4327
    ≥2000
    484.1597
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    Conn Header 5pr 10col Open Ee Bp
    7544
    1-9
    246.7555
    10-49
    240.3184
    50-99
    235.3833
    100-199
    233.6667
    200-499
    232.3793
    500-999
    230.6628
    1000-1999
    229.5899
    ≥2000
    228.5171
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    Conn Backplane HDR 200POS 1.85mm Press Fit ST Thru-Hole Tube
    9377
    1-9
    417.1165
    10-49
    406.2352
    50-99
    397.8929
    100-199
    394.9912
    200-499
    392.8149
    500-999
    389.9133
    1000-1999
    388.0997
    ≥2000
    386.2862
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    1.85毫米由1.85毫米( 0.073由0.073 )间距3对GbX®背板连接器系统,打开域名, 60电路,无铅,引脚长度4.55毫米( 0.179 ) 1.85mm by 1.85mm (.073 by .073) Pitch 3-Pair GbX® Backplane Connector System, Open Header, 60 Circuits, Lead Free, Pin Length 4.55mm (.179)
    4934
    1-9
    307.4065
    10-49
    299.3872
    50-99
    293.2391
    100-199
    291.1006
    200-499
    289.4967
    500-999
    287.3583
    1000-1999
    286.0217
    ≥2000
    284.6852
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    1.85毫米由1.85毫米( 0.073由0.073 “ )间距3对GbX®背板连接器SystemRight指南头, 150电路,无铅,引脚长度4.55毫米( 0.179 ” ) 1.85mm by 1.85mm (.073 by .073") Pitch 3-Pair GbX® Backplane Connector SystemRight Guide Header, 150 Circuits, Lead Free, Pin Length 4.55mm (.179")
    9231
    1-9
    328.1065
    10-49
    319.5472
    50-99
    312.9851
    100-199
    310.7026
    200-499
    308.9907
    500-999
    306.7083
    1000-1999
    305.2817
    ≥2000
    303.8552
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    1.85毫米由1.85毫米( 0.073由0.073 )间距3对GbX®背板连接器系统,打开域名, 30电路,无铅,引脚长度4.55毫米( 0.179 ) 1.85mm by 1.85mm (.073 by .073) Pitch 3-Pair GbX® Backplane Connector System, Open Header, 30 Circuits, Lead Free, Pin Length 4.55mm (.179)
    4836
    1-9
    63.3765
    10-99
    60.6210
    100-249
    60.1250
    250-499
    59.7392
    500-999
    59.1330
    1000-2499
    58.8575
    2500-4999
    58.4717
    ≥5000
    58.1411
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    1.85毫米由1.85毫米( 0.073 “由0.073 ” )间距2对GbX®背板连接器SystemRight指南头, 100电路引脚长度5.55毫米( .219 “ ) ,无铅 1.85mm by 1.85mm (.073" by .073") Pitch 2-Pair GbX® Backplane Connector SystemRight Guide Header, 100 Circuits, Pin Length 5.55mm (.219"), Lead Free
    7301
    1-9
    209.4725
    10-49
    204.0080
    50-99
    199.8186
    100-199
    198.3614
    200-499
    197.2685
    500-999
    195.8113
    1000-1999
    194.9005
    ≥2000
    193.9898
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    Conn Hard Metric HDR 200POS 2mm Press Fit ST Thru-Hole Tube
    1403
    1-9
    177.6290
    10-49
    172.9952
    50-99
    169.4426
    100-199
    168.2069
    200-499
    167.2802
    500-999
    166.0445
    1000-1999
    165.2722
    ≥2000
    164.4999
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.00毫米( .079 “ )间距6行VHDM®精简版背板头,右盾EndVersion , 6排, 60电路,引脚长度4.75毫米( .187 ” ) 2.00mm (.079") Pitch 6-Row VHDM® Lite Backplane Header, Right Shield EndVersion, 6 Row, 60 Circuits, Pin Length 4.75mm (.187")
    5217
    1-9
    102.1775
    10-99
    97.7350
    100-249
    96.9354
    250-499
    96.3134
    500-999
    95.3361
    1000-2499
    94.8918
    2500-4999
    94.2699
    ≥5000
    93.7368
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.00毫米( 0.079 )间距6行VHDM®精简版背板头,左盾尾版, 6排, 60电路,引脚长度4.75毫米( .187 ) 2.00mm (.079) Pitch 6-Row VHDM® Lite Backplane Header, Left Shield End Version, 6 Row, 60 Circuits, Pin Length 4.75mm (.187)
    2676
    1-9
    111.9755
    10-99
    107.1070
    100-249
    106.2307
    250-499
    105.5491
    500-999
    104.4780
    1000-2499
    103.9912
    2500-4999
    103.3096
    ≥5000
    102.7254
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.00毫米( .079 “ )间距8行VHDM®精简版背板头,导柱信号模块,针端版本, 80电路,引脚长度4.75毫米( .187 ” ) 2.00mm (.079") Pitch 8-Row VHDM® Lite Backplane Header, Guide Pin Signal Module,Pin End Version, 80 Circuits, Pin Length 4.75mm (.187")
    8733
    1-9
    107.0880
    10-99
    102.4320
    100-249
    101.5939
    250-499
    100.9421
    500-999
    99.9178
    1000-2499
    99.4522
    2500-4999
    98.8003
    ≥5000
    98.2416

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